職責描述：
. 負責新產品在外包廠的認證。
. 根據客戶需求定義BOM，產品規范及工藝規范。
. 與foundry及subcon緊密合作，進行工藝改善和項目日程管理。
. 探尋產品改善及成本下降的技術革新方案。
Responsibilities
. Responsible fnew product qualification in subcon.
. Define BOM, product process specification based on customer requirements
. Work closely with foundry subcon in both process improvement project management.
. Research technology innovations in product improvement cost reduction.
任職要求：
. 理工科本科或碩士。
. 3年以上封裝經驗，有外包管理經驗更佳。
. 熟悉半導體封裝產品（LF，BGA等）及封裝工藝（DA，WB，mold，FC mount，underfill等），有封裝設計經驗者更佳。
. 熟悉品質和可靠性測試條件及規范。
. 熟悉失效分析方法。
. 熟悉數據分析/處理及DOE方法。
. 善于溝通，英語流利，能承受工作壓力，可以出差，良好的團隊合作能力。
Qualifications
. Master bachelof engineering.
. Above 3 years in semiconductpackaging. Experience in subcon management is preferred.
.Familiar with semiconductpackage products (LF, BGA etc.) manufacturing process (DA,WB,Mold,etc.). Experience in PKG design is preferred.
. Familiar with quality reliability test conditions specifications.
. Familiar with failure analysis method.
. Familiar with statistics data analysis DOE methods.
. Good communication skills. Fluent writtenal English. Good team player. Ability to work under pressure. Willing to travel.