Summary: A discrete power device product engineer with certain work experience, responsible fthe development of new discrete devices (such as SiC、GaN、SGT、SJ etc.), covering from target specification setting to large-scale production stage. The job responsibilities include testing plan design, product characterization verification reliability assessment, improvement of product yield, resolution of various production related issues, continuous quality improvement. 具備一定工作經(jīng)驗(yàn)的分立功率器件產(chǎn)品工程師，負(fù)責(zé)分立器件（SiC、GaN、SGT、SJ等）新產(chǎn)品的開發(fā)工作，涵蓋從目標(biāo)規(guī)格設(shè)定到大規(guī)模量產(chǎn)階段。工作內(nèi)容包括測(cè)試計(jì)劃設(shè)計(jì)、產(chǎn)品特性化驗(yàn)證和可靠性鑒定、產(chǎn)品良率的提升、生產(chǎn)相關(guān)的各類問題的解決以及持續(xù)的質(zhì)量改進(jìn)。 RESPONSIBILITIES: 1. Co-work with device design engineer, marketing engineer to finish device requirement analysis, competitanalysis, construction analysis, build up the product development target plan. Product types include not limited to SiC, GaN, SGT, SJ etc. 與器件設(shè)計(jì)工程師, 市場(chǎng)工程師共同完成器件設(shè)計(jì)需求分析、競(jìng)爭(zhēng)對(duì)手分析、結(jié)構(gòu)分析等，制定產(chǎn)品開發(fā)目標(biāo)和計(jì)劃。產(chǎn)品類型包括但不限于SiC、GaN、SGT、SJ等。 2. Collaborate with testing engineers to develop device testing plans schemes, complete testing verification.協(xié)同測(cè)試工程師制定器件測(cè)試計(jì)劃和測(cè)試方案，完成測(cè)試驗(yàn)證。 3. Responsible ffollowing up on the fab packaging of new products throughout the process, analyzing, identifying, addressing various issues during the product preparation process. 負(fù)責(zé)全程跟進(jìn)新產(chǎn)品的流片、封裝，并分析、識(shí)別、處理產(chǎn)品制備過(guò)程中的各類問題。 4. Support product characterization, collaborate with design, application engineer to write the datasheet specifications. 完成產(chǎn)品特性驗(yàn)證，與設(shè)計(jì)、應(yīng)用工程師合作編寫數(shù)據(jù)表規(guī)范。 5. Complete product reliability testing continuously promote product yield improvement.完成產(chǎn)品的可靠性測(cè)試并持續(xù)推進(jìn)產(chǎn)品的良率改善。 6. Collaborate with internal team fengineering sample support delivery. 協(xié)同內(nèi)部團(tuán)隊(duì)，確保工程樣品的按時(shí)交付； 7. Engage in solving all issues meet internal external to improve the product quality across the product lifetime. 介入解決產(chǎn)品生命周期中面臨的各種內(nèi)部或外部問題，以提升產(chǎn)品質(zhì)量； 8. Support on products subcon (fab/bumping/assembly/test etc.) transfer. 參與產(chǎn)品外包工廠(晶圓代工/凸點(diǎn)代工/封裝/測(cè)試等)的遷移。 REQUIREMENTS: 1. Masters students majoring in microelectronics related fields, with at least two years of work experience in domestic international power device semiconductcompanies preferred. 微電子及相關(guān)專業(yè)碩士研究生，有國(guó)內(nèi)、國(guó)際功率器件半導(dǎo)體大廠工作兩年以上經(jīng)歷者優(yōu)先。 2. NPI experience of SiC, GaN, SGT MOS etc. products development is specially preferred. 有SiC、GaN、SGT MOS等產(chǎn)品開發(fā)NPI經(jīng)驗(yàn)者尤佳。 3. Familiar with discrete power device product characterization qualification (ESD/LU/HTRB/HTGB/H3TRB/IOL etc.). 熟悉分立功率器件的特性化驗(yàn)證和可靠性鑒定(ESD/LU/HTRB/HTGB/H3TRB/IOL etc.). 4. Strong experience in managing R&D projects, strong communication coordination skills, excellent sense of responsibility teamwork spirit. 有較強(qiáng)的研發(fā)項(xiàng)目的管理經(jīng)驗(yàn)，溝通協(xié)調(diào)能力強(qiáng)，責(zé)任心及團(tuán)隊(duì)合作精神優(yōu)秀。 5. Experience of low yield analysis quality issue solving fnew products. 具備低良率數(shù)據(jù)分析和質(zhì)量相關(guān)問題的處理經(jīng)驗(yàn)； 6. Experience of managing sub-contractors at different locations. 具備與各地外包商協(xié)作的經(jīng)驗(yàn)； 7. Proficient in the use of various test instruments, including but not limited to semiconductcurve tracer, oscilloscope, discrete tester, etc. 精通各種測(cè)試儀器的使用，包括但不限于晶體管特性圖示儀，示波器，分立器件測(cè)試機(jī)等； 8. Good communication coordination skills, ability to withstpressure, strong sense of responsibility execution ability. 有良好的溝通協(xié)調(diào)能力，抗壓能力，工作責(zé)任心和執(zhí)行力佳。 9. Good English reading, writing, listening, speaking skills, can smoothly communicate with foreign colleagues. 良好的英語(yǔ)讀、寫、聽、說(shuō)能力，能與外國(guó)同事順暢溝通。